• UV Glue Remover Machine
  • UV Glue Remover Machine
  • UV Glue Remover Machine
  • UV Glue Remover Machine

UV Glue Remover Machine

Brand Shenyang Kejing

Product origin Shenyang, China

Delivery time 10 working days

Supply capacity 50 sets

1. The UV film debonding LED curing machine emits uniform, stable and strong light, which can shorten the curing time of the product.
2. The UV film debonding LED curing machine has low heat radiation and is particularly suitable for liquid crystal edge sealing, plastic substrates, film printing, medical equipment, and optical lenses where heating is required.
3. The UV film debonding LED curing machine has low energy consumption, and its power consumption is 10% of that of traditional mercury lamp curing machines, which can save 90% of electricity.

UV Glue Remover Machine

Introduction of UV LED debonding machine:

The UV-801 debonding machine is a debonding machine specially used for wafers, QFN, glass, substrates, mobile phone modules and ceramics, etc., which are pasted with UV film after cutting. The UV LED debonding machine uses LED cold light source and editable controller + full-color touch screen as operating system, so the equipment performance is more stable and easy to operate.

UV film debonding LED curing machine

Advantages of UV LED curing machine for wafer film debonding:

1. UV LED curing machine for wafer film debonding has a long service life, and the LED life can reach more than 20,000 hours, reducing the cost of consumables.

2. UV LED curing machine for wafer film debonding does not need to be preheated, it can be used immediately after turning on, and the light intensity is instantly reached.

3. UV LED curing machine for wafer film debonding is safe and environmentally friendly, does not contain mercury, and does not produce ozone.

4. UV LED debonding machine can customize UVLED surface light source according to customer's actual application.

5. The desktop system of UV LED debonding machine is compact in design and occupies a small area.

UV LED curing machine for wafer film debonding


Technical parameters of UV LED debonding machine:

Product name

UV-801 Film Debonding LED Curing Machine

Product model

UV-801
Main parameters

1. Power supply voltage: AC220V, 50/60Hz.

2. Rated power: 1200W. .

3. Applicable size: ≤8inch.

4. Lighting size: 200*200mm.

5. Lamp wavelength: 365nm.

6. Irradiation height: 50-150mm.

7. Cooling method: Air cooling.

8. Equipment size: 575*350*241mm.

9. Weight: about 20kg.


FAQ:

Will the degumming process cause thermal damage to the product?

The UV-801 degumming machine uses LED cold light source with low thermal radiation, which is particularly suitable for plastic substrates and temperature-sensitive materials and will not damage the product due to high temperature.


About us:

In order to better serve our customers, we have established a high-quality customer service center. Customers can bring samples to our company and conduct trial production in our dedicated laboratory, which helps customers understand the performance of our products. Our company's professionals can also provide appropriate product selection suggestions so that customers can purchase the right equipment.

UV LED debonding machine



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