• Heavy Duty (8

    Heavy Duty (8") Precision Grinding And Polishing Machine

    1. The speed of the single position grinding polishing machine can be infinitely adjusted, and the grinding speed can be accurately controlled according to different materials and process requirements. The grinding polishing machine increases the flexibility of operation. 2. During the operation of the grinding polishing machine, the user can manually adjust the pressure to accurately control the grinding and polishing process. 3. The metallographic manual polishers can directly use tap water for cooling during grinding and polishing, which simplifies the cooling process, prevents the sample from overheating, and improves the grinding efficiency.

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  • Dual Plates Automatic Pressure Lapping And Polishing Machine

    Dual Plates Automatic Pressure Lapping And Polishing Machine

    UNIPOL-1000D Dual-Plate Pressure Grinding and Polishing Machine is mainly used in the field of material research, and is widely used laboratories of universities and research institutes for automatic grinding and polishing samples of metal, ceramics, glass, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium), rock samples, mineral samples, composite materials, organic polymer materials, etc. as well as small-scale production in factories. UNIPOL-1000D dual-plate pressure grinding and polishing machine is equipped with two grinding and polishing work stations, which can perform grinding and polishing operations respectively, not only avoiding cross-contamination, but also improving work efficiency.

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  • 20

    20" Precision Polishing Machine

    1. Automatic floor-standing laboratory grinding polishing machine, suitable for plane thinning and polishing of large-sized materials such as 6 inches and 8 inches. 2. The laboratory grinding polishing machine has three processing stations to ensure uniform surface quality of the sample after grinding. 3. The laboratory grinding polishing machine can make the sample surface have high flatness and will not chamfer the edge of the sample.

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