At present, as early as 2016, the global monocrystalline silicon wafer producers have basically switched all traditional mortar cutting (silicon carbide powder, steel wire, polyvinyl alcohol mixture) to diamond wire saw, which has greatly reduced the cost of monocrystalline silicon wafers, resulting in a certain cost-effectiveness advantage in the competition with multicrystalline silicon wafers. Therefore, multicrystalline silicon wafers must all switch to diamond wire slicing as soon as possible. Multicrystalline silicon wafer companies that do not switch will face the dilemma of being unable to survive.