What are the Factors Affecting High Vacuum Magnetron Sputtering?

On the basis of basic magnetron sputtering,high vacuum and high temperature growth environment are introduced, and plasma technology is combined to improve the reaction efficiency of reactive deposition, so as to realize magnetron sputtering film epitaxy. The film prepared under this high vacuum condition has a better lattice orientation and more outstanding crystal properties. It has a wide range of applications in superconducting quantum, ferroelectric materials, piezoelectric materials, thermoelectric materials and other fields. The high vacuum state helps to reduce the influence of impurities and ensure that the sputtered particles do not react adversely with other gases during the deposition process.

The target material is the source of materials for high vacuum magnetron sputtering. The material of the target material determines the composition and properties of the deposited film. Different types of target materials, such as metal, alloy or compound target materials, affect the properties of the deposited film. The composition, purity, grain size, orientation, etc. of the target material for high vacuum magnetron sputtering directly affect the composition, structure and properties of the film.The magnetic properties of the target material for high vacuum magnetron sputtering, such as saturation magnetization and coercive force, affect the plasma behavior and magnetic properties of the film during sputtering. The cleanliness and roughness of the target surface for high vacuum magnetron sputtering affect the sputtering rate and film quality.

When the coating material and substrate have been determined, the selection of process parameters will have a great impact on the coating quality and coating growth rate. Sputtering power will affect the sputtering rate, film composition and structure. When the sputtering power is too high, the target material source of the coating may overheat, the internal stress of the film may increase, and the film may rupture; when the power is too low, the sputtering rate will be slow, the film structure will be loose, the particles will be large, and the film quality will be poor.

Our company always adheres to the business philosophy of "customer first, quality first", provides customers with high-quality products and services, and has won a good market reputation. The high vacuum magnetron sputtering instrument produced by our company is a newly independently developed coating equipment, which can be used to prepare single-layer or multi-layer ferroelectric films, conductive films, alloy films, semiconductor films, ceramic films, dielectric films, optical films, oxide films, hard films, polytetrafluoroethylene films, etc. It is not only widely used, but also has the advantages of small size and easy operation. It is an ideal equipment for preparing material films in the laboratory.