The Rise Of Chemical Mechanical Polishing Technology
With the rapid development of the semiconductor industry, the size of electronic devices continues to shrink, and the requirements for wafer surface flatness are becoming more stringent. Especially in today's integrated circuit manufacturing process, the wafer surface needs to be flattened at the nanometer level, and traditional local flattening technology can no longer meet this demand. However, our UMIPOL-1203 chemical mechanical polishing machine can currently achieve global flattening.
Chemical mechanical polishing technology has emerged since the 1990s and has become an indispensable part of the manufacturing process of very large scale integrated circuits (VLSI). Compared with traditional local planarization processes such as thermal flow method, spinning glass method, and selective deposition, UNIPOL-1203 chemical mechanical polishing machine can not only achieve comprehensive planarization, but also has the advantages of simple process, high efficiency, and low cost. Chemical mechanical polishing machine is widely used in silicon wafer graphics processing.
Shenyang Kejing fully automatic chemical mechanical polishing machine can not only provide high-precision planarization of silicon wafers, but is also widely used in precision grinding and polishing of ceramic and metal materials. The anti-corrosion materials used in the fully automatic chemical mechanical polishing machine can operate efficiently even when the grinding fluid is corrosive, greatly improving the durability and adaptability of the equipment.
The core features and technical advantages of chemical mechanical grinding and polishing machine:
1. High-precision flattening: Chemical mechanical grinding and polishing machine is equipped with ultra-flat stainless steel polishing disc and ultra-precision rotating axis, auto chemical mechanical polishing machine can control the surface flatness at the nanometer level.
2. Automated design: Chemical mechanical grinding and polishing machine has a fully automatic control touch screen, which can set the spindle speed, swing arm speed and grinding and polishing time, support multi-task operation, and further improve the processing efficiency.
3. Corrosion-resistant design: The grinding part of auto chemical mechanical polishing machine is made of chemical corrosion-resistant materials, which can cope with the corrosion of different chemical polishing liquids and adapt to a wide range of material grinding needs.
Auto chemical mechanical polishing machine provides efficient and precise flattening processing methods for enterprises in the semiconductor industry, precision manufacturing and materials science. In addition, our products have been exported to japan, russia, europe and other countries and regions, and have been well received by customers. Welcome to our company or send us your needs, we will become your trusted partner!