How To Use Precision Manual Diamond Wafer Scriber
The cutting machine is a device specially used for cutting thin slices or samples. It is suitable for cutting thin single crystal substrates. The cutting pressure can be adjusted by springs. The cutting stroke is 100mm. The operation is relatively simple but requires certain skills and precautions. Let us fully understand how to use it!
First, we need to prepare the workbench and sample. Make sure to use a flat workbench and clean the workbench surface to avoid sample contamination or dicing error. The sample to be cut must ensure that the sample size is suitable for the workbench size range of the dicing machine. The second step is to set up the dicing machine. We need to place the dicing saw on a stable plane and make sure it is fixed to avoid movement or shaking during operation. Adjust the blade position and cutting depth of the dicing machine and set appropriate cutting parameters as needed. The third step is to install the sample. We place the sample to be cut on the workbench of the wafer saw and ensure that the sample position is accurate and stable. The sample should be placed as horizontally and flatly as possible to ensure the accuracy and consistency of the cutting. The fourth step is to adjust the dicing machine parameters. According to the material and thickness of the sample, adjust the dicing speed and depth of the dicing machine. Then we can start dicing, start precision glass cutter, and start cutting samples according to the preset cutting path and speed. During the cutting process, pay attention to the status of the blade and the sample to ensure that the cutting process goes smoothly.
After the cutting is completed, we can check the quality and accuracy of the cut samples. If you need to adjust the cutting parameters or the position of the tool, you can reset it and cut again. The last step is cleaning and maintenance. After the cutting is completed, clean the workbench and the dicing machine in time to prevent the residue from affecting the next use and regularly maintain the wafer cutter, including cleaning the tool and the body, lubricating the moving parts, and checking whether each part is working properly.
I believe that through the introduction, everyone has fully understood how to use wafer cutter. Our company has many years of experience in producing cutting machines. Welcome new and old customers to cooperate with us.