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The Rise Of Chemical Mechanical Polishing Technology
The Rise Of Chemical Mechanical Polishing Technology

With the rapid development of the semiconductor industry, the size of electronic devices continues to shrink, and the requirements for wafer surface flatness are becoming more stringent. Especially in today's integrated circuit manufacturing process, the wafer surface needs to be flattened at the nanometer level, and traditional local flattening technology can no longer meet this demand. However, our UMIPOL-1203 chemical mechanical polishing machine can currently achieve global flattening.

2024/10/19
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